1、 System Capability
XY Placement: ± 25μm
Angular Placement: ±1°
UPH: 18k
2、 Material Handling Capability
Die Size: 0.25mm to 5mm(10-200mil)
Leadframe Size: Length:100mm to 300mm
Width: 15mm to 100mm
Thickness: 0.1mm to 0.8mm
Lo a d ing System: Stack Loader & Magazine Handler
3、 Bond Head
Bond Force: 30-250g
Bonding Method: Epoxy
4、 Dispensing System
Dual time-Pressure Dispensing
Dispensing Controller: Musashi
5、 Wafer Stage
Wafer Size: 12inch
6、 Facliities Required
Voltage: 220VAC
Frequency: 50Hz
Compressed Air: Min.5bar
Flower Rate: 250LPM @5 bar
Power Consumption: -1500W
7、 Dimensions:
Weight: 2000kg
W×D×H: 2300×1500×1800mm
8、 HX Series
Epoxy Die Attach Solution: