贴装速度
|
CPH(IPC9850)
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1608CHIP:?21K?CPH(IPC)
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1005CHIP:?20K?CPH(IPC)
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SOP16:?15K?CPH(IPC)/供料器
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QFP100:?5.5K?CPH(IPC)/托盘
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贴装精度
|
CHIP
|
±50??(0402@3σ)
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QFP
|
±30??(QFP168@3σ)
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贴装范围
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标准配置
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1005?~?□22mm?IC?(CSP?0.75)?(飞行视袈)
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~?□32mm?IC?(0.4P)
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~?□55mm?IC?(0.65P?/?MFOV)?(固定视袈)
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选件
|
0402?~?□7mm?IC?(CSP?0.65)
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0603?~?□12mm?IC?(CSP?0.75)?(飞行视袈)?~?□17mm?IC?(0.3P)
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?~?□42mm?IC?(0.5P)?~?72mm?connector?(0.65P/?MFOV)?(固定视袈)
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最大高度
|
H15mm?(固定视袈)
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窄间距贴装
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0402?Chip?:?P?0.10mm?0603?Chip?:?P?0.15mm
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供料器数量
|
Max.?120?EA
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贴装尺寸
|
标准
|
460?x?400?x?4.2?~?50?x?40?x?0.38?(重量3?kg)
|
选件
|
510?x?460?x?4.2?~
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特殊定制
|
610?x?510?x?4.2?~
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外形尺寸(mm)
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L1,?650?x?D1,?680?x?H1,?530
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重量(kg)
|
1,800?kg
|
能耗
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耗电量
|
3?phase,?AC?200/208/220/240/380/415?,4.7?kVA?(Rating?3?kVA)
|
耗气量
|
50/60?Hz
|
