The lead free Stannol SP 2500 no-clean solderpaste is designed to achieve extraordinary wetting
characteristics in combination with a wide spreaded process window for perfect soldering results.
Being optimized for lead free alloy compositions and fine pitch powder sizes (T4)
the Stannol SP 2500 is the primary choice for high production throughput.
High Quality soldering results can be expected on a variety of different surface finishes with transparent residues. In
comparison to various other solder pastes the SP 2500 tends to a significant void reduction in particular with BGA and QFN
components.
To achieve the full performance of void reduction in number and size