Specification:
Total Power |
4800W |
Top heater |
800W |
Bottom heater |
Second heater 1200W, IR preheating 2700w |
Power |
AC220V±10% 50/60Hz |
Dimensions |
L520×W490×H700 mm |
Infrared heat size
|
L250×W320 mm |
Positioning |
V-groove, PCB support can be adjusted in any direction with external universal fixture |
Temperature control |
K Sensor, Closed loop |
Temp accuracy |
±2℃ |
PCB size |
Max 400mmⅹ350mm Min20mmⅹ20mm |
BGA chip |
5*5~55*55 |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
1(optinal) |
Net weight |
27KG |
DH-A09 技术参数
总功率 |
Total Power |
4800W |
上部加热功率 |
Top heater |
800W |
下部加热功率 |
Bottom heater |
第二温区1200W,第三温区2700W(加大型发热面积适应各类PCB板) |
电源 |
power |
AC220V±10% 50Hz |
外形尺寸 |
Dimensions |
L470×W510×H650 mm |
定位方式 |
Positioning |
V字形卡槽,PCB支架可X、Y 任意方向调整并配置万能夹具 |
温度控制方式 |
Temperature control |
K型热电偶(K Sensor) 闭环控制(Closed loop) |
温度控制精度 |
Temp accuracy |
±2度 |
PCB尺寸 |
PCB size |
Max 390mmⅹ380mm Min20mmⅹ20mm |
适用芯片 |
BGA chip |
5*5~55*55 |
适用最小芯片间距 |
Minimum chip spacing |
0.15mm |
外置测温端口 |
External Temperature Sensor |
1个 |
机器重量 |
Net weight |
约27KG |
Feature:
1.Embedded high accuracy meter controls,has instant data analysis function,real-time display setting and actual measurement data,and be able to analyze and correct the data.
2.It uses precise K-type close circuit control and automatic temperature adjustment system, with temperature module to enable precision temperature control of ±2 deg C. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
3.V-groove PCB support for rapid,convenience and accurate positioning that fits for all kinds of PCB board.
4.Flexible and convenient removable fixture on the PCB board which protects and prevent damage to PCB. It can also adapt to rework various BGA packages.
5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;
6.Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.
7.There are 6-8 levels of variable and constant temperature controls,can save 10 segment temperature setting,adjust kinds of BGA rework station.
8.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip
9.After heating,cooling system automatically starts,When temperature drop to normal,automatically stop cooling,ensure not burn-in the machine.
10.CE certification, with emergency switch and automatic power-off protection device when emergency
DH-A09主要性能与特点:
● 本机采用三温区设计,上、下部为热风加热,预热区为IR加热,三个温区独立控温,配置高精度温控仪表,可同时设置8段升降温,能同时储存10组温度设定, 外置测温接口,可以适时的设定、修改、细化每一个温度参数
● 采用高精度K型热电偶闭环控制和温度自动补偿系统,并结合温度模块实现对温度的精准控制,保证温度偏差在±2度.同时外置测温接口实现对温度的精密检测,并实现对实测温度曲线的精确分析和校对.
● PCB板定位采用V字型槽,定位快捷、方便、准确,满足不同PCB板排版方式及不同大小PCB板的定位.
● 灵活方便的可移动式万能夹具对PCB板起到保护作用,防止PCB边缘器件损伤及PCB变形,并能适应各种BGA封装尺寸的返修.
● 配备多种规格合金风嘴,该风嘴可360度任意旋转定位,易于安装和更换;
● 8段升(降)温+8段恒温控制
● 在拆卸、焊接完成后以声控方式警示作业人员作相关准备;同时在拆卸、焊接完成后采用大流量横流风扇自动/手动对PCB板进行冷却,防止PCB板变形,保证焊接效果.
● 经过CE认证,设有自动断电保护装置.